Failure Analysis

World-class failure analysis capabilities determine root causes for one-of-a-kind units. An experienced, multi-disciplinary team utilizes an advanced toolset within Cirrus Logic's own Device Physics and Failure Analysis Laboratory.

Cirrus Logic’s Typical Failure Analysis Work Flow

Cirrus Logic’s FA Tools and Capabilities

Electrical Analysis


Real-time On-line Product Analysis Database
Tracing the history of a failure mode/mechanism to reduce analysis cycle time, recognize trends and track ongoing analyses

WLCSP & BGA Rework/Re-ball Roolset
Package reconditioning for test capability

Open/Short/Leakage Parametric Testing
Parametric failure replication - ability to connect to all device pins over a wide range of package types

ATE Testers and Evaluation Board Setups
Functional failure replication - analysis requires ability to fully exercise the failure mode while allowing access to device circuitry

Package X-ray, Acoustic Microscopy
Package integrity inspection

Topside Package De-capsulation
Unsurpassed decapsulation capability ranging from 5 pin TSSOPs to 352 BGAs while maintaining device functionality

Backside Package De-capsulation
Access to the die backside surface enabling through silicon analysis techniques

Near IR Optimized Light Emission Analysis (LEM)
Near infrared offers enhanced front side or through silicon capability for this time-saving analysis shortcut

Laser Scanning Microscope (LSM) & InGaAs Emission
Capability of performing die topside and backside LEM, OBIRCH, TIVA diagnostics, as well as advanced fault isolation technics like LVP, LVI and SIL

CAD Software Tools
Circuit and mask layer navigation and cross linking for debug

Focused Ion Beam (FIB)
Probe access point creation and circuit modifications

Functional Micro-probing
Method of tracing a failure by probing through circuitry to pin point the failure - time consuming, but necessary at times

Nanoprobing
Fault isolation on advanced process nodes, including e-beam absorbed/induced current methods

Atomic Force Microscopy (AFM)
Nano scale electrical characterization utilizing conductive and tunneling imaging

Physical Analysis


Dry and Wet Etch Top-down De-processing
Capability to choose the correct deprocessing method for the type of defect isolated by electrical analysis

Dual Beam FIB
Precision cross-sectioning and high resolution imaging

Optical Inspection Microscopes
High resolution water immersion, confocal and laser scanning imaging with integrated digital image capture

Mechanical Cross-sectioning
For rapid inspection and monitoring of Fab processes

SEM/EDS Imaging and X-ray Elemental Analysis
Ultra high resolution imaging for identification of failure mechanisms at the Fab process level


ESD and Latchup


JEDEC Compliant ESD/Latchup Testing
Multi-system in-house testing for rapid design feedback and complete debug capability

Electrical Analysis


Real-time On-line Product Analysis Database
Tracing the history of a failure mode/mechanism to reduce analysis cycle time, recognize trends and track ongoing analyses

WLCSP & BGA Rework/Re-ball Roolset
Package reconditioning for test capability

Open/Short/Leakage Parametric Testing
Parametric failure replication - ability to connect to all device pins over a wide range of package types

ATE Testers and Evaluation Board Setups
Functional failure replication - analysis requires ability to fully exercise the failure mode while allowing access to device circuitry

Package X-ray, Acoustic Microscopy
Package integrity inspection

Topside Package De-capsulation
Unsurpassed decapsulation capability ranging from 5 pin TSSOPs to 352 BGAs while maintaining device functionality

Backside Package De-capsulation
Access to the die backside surface enabling through silicon analysis techniques

Near IR Optimized Light Emission Analysis (LEM)
Near infrared offers enhanced front side or through silicon capability for this time-saving analysis shortcut

Laser Scanning Microscope (LSM) & InGaAs Emission
Capability of performing die topside and backside LEM, OBIRCH, TIVA diagnostics, as well as advanced fault isolation technics like LVP, LVI and SIL

CAD Software Tools
Circuit and mask layer navigation and cross linking for debug

Focused Ion Beam (FIB)
Probe access point creation and circuit modifications

Functional Micro-probing
Method of tracing a failure by probing through circuitry to pin point the failure - time consuming, but necessary at times

Nanoprobing
Fault isolation on advanced process nodes, including e-beam absorbed/induced current methods

Atomic Force Microscopy (AFM)
Nano scale electrical characterization utilizing conductive and tunneling imaging



Physical Analysis


Dry and Wet Etch Top-down De-processing
Capability to choose the correct deprocessing method for the type of defect isolated by electrical analysis

Dual Beam FIB
Precision cross-sectioning and high resolution imaging

Optical Inspection Microscopes
High resolution water immersion, confocal and laser scanning imaging with integrated digital image capture

Mechanical Cross-sectioning
For rapid inspection and monitoring of Fab processes

SEM/EDS Imaging and X-ray Elemental Analysis
Ultra high resolution imaging for identification of failure mechanisms at the Fab process level


ESD and Latchup


JEDEC Compliant ESD/Latchup Testing
Multi-system in-house testing for rapid design feedback and complete debug capability


Learn how we achieve the highest levels of product quality and reliability.

Contact Support


Connect with us or our authorized third-party sales representatives, services partners, and our distributors for design questions or pricing requests.


Contact Support


Connect with us or our authorized third-party sales representatives, services partners, and our distributors for design questions or pricing requests.


PDF

First Choice in Quality