Cirrus Logic differentiates itself from other fabless IC design firms with a complete Product Analysis Laboratory. The lab has a history of successful root cause determination on one-of-a-kind units. With an experienced, multi-disciplinary analysis team using advanced toolsets, the lab offers world-class capability.
| Analysis Tool/Technique | Capability |
|---|---|
| Electrical Analysis | |
| Real time on-line product analysis database | Tracing the history of a failure mode/mechanism to reduce analysis cycle time, recognize trends and track ongoing analyses |
| BGA re-ball toolset | Package reconditioning for test capability |
| Open/Short/Leakage parametric testing | Parametric failure replication - ability to connect to all device pins over a wide range of package types |
| ATE testers and evaluation board setups | Functional failure replication - analysis requires ability to fully exercise the failure mode while allowing access to device circuitry |
| Package X-ray to verify package integrity | Package integrity inspection |
| Topside Package decapsulation | Unsurpassed decapsulation capability ranging from 5 pin TSSOP's to 352 BGA's while maintaining device functionality |
| Backside package decapsulation | Access to the die backsurface enabling through silicon analysis techniques |
| Near IR optimized Light Emission analysis (LEM) | Near infrared offers enhanced frontside or through silicon capability for this time-saving analysis shortcut |
| CAD software tools | Circuit and mask layer navigation and cross-linking for debug |
| Focused Ion Beam (FIB) | Probe access point creation and circuit modifications |
| Functional Micro-probing | Time-consuming but at times necessary method of tracing a failure by probing through circuitry to pin point the failure |
| Physical Analysis | |
| Dry and wet etch top down deprocessing | Capability to choose the correct deprocessing method for the type of defect isolated by electrical analysis |
| Dual Beam FIB | Precision cross-sectioning and high resolution imaging |
| Optical inspection microscopes | High resolution water immersion, confocal and laser scanning imaging with integrated digital image capture |
| Mechanical Cross-sectioning | For rapid inspection and monitoring of Fab processes |
| SEM/EDS imaging and X-ray elemental analysis | Ultra-high resolution imaging for identification of failure mechanisms at the Fab process level |
| Additional Analysis | |
| JEDEC compliant ESD/Latchup testing | Multi-system in-house testing for rapid design feedback and complete debug capability |
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