Restriction of Hazardous Substances (RoHS) Compliance
Cirrus Logic is actively committed to our role in protecting the environment by reducing the amount of hazardous substances in our products. As a member of JEDEC, the semiconductor standardization body of the Electronics Industries Alliance (EIA), Cirrus Logic is working with customers and suppliers to comply with industry standards.
- The European Union has enacted legislation (Directive 2002/95/EC) effective July 1st, 2006 that restricts the use of Lead, Cadmium, Mercury, Hexavalent Chromium, Poly-Brominated Bi-Phenyls (PBB), and Poly-Brominated Di-Phenyl Ethers (PBDE) in a wide variety of electronic products and applications.
- Cirrus Logic’s standard product offerings contain lead (Pb) in solder plating, and are therefore not RoHS compliant. They do not contain any of the other 5 restricted substances (Cd, Hg, Cr6+, PBB, PBDE), and are therefore sometimes referred to as being “5/6 RoHS compliant.”
- Cirrus Logic offers Pb-free product versions which fully meet the definition of RoHS compliance:
Restricted substances are not intentionally added to the product
The presence of any of the restricted substances does not exceed the maximum stated concentration per homogeneous material as defined by the RoHS directive and shown in the following table:
| Substance |
Limit per
Homogeneous Material |
| Cadmium |
100 ppm |
| Lead |
1000 ppm |
| Mercury |
1000 ppm |
| Hexavalent Chromium |
1000 ppm |
| Poly-brominated Bi-Phenyls |
1000 ppm |
| Poly-brominated Di-Phenyl Ethers |
1000 ppm |
Pb-Free / RoHS Compliant Standards
RoHS Certificate of Compliance
Pb-free / RoHS Compliant Part Numbering and Identification
- Note: For RoHS Compliance Identification on Apex Precision Power devices please refer to the Apex Precision Power RoHS website.
- Pb-free / RoHS compliant products will have a “Z” suffix added after the package designator in the marketing part number.
| Standard Version |
Pb-free Version |
| CS4334-KS |
CS4334-KSZ |
| CS4272-DZ |
CS4272-DZZ |
Example:
- The “Z” suffix does not apply to Apex Precision Power devices, please refer to the above Apex Precision Power site for RoHS related information on these products.
- The request for Pb-free / RoHS compliant product must be specified by part number in the written purchase order prepared by the customer.
Pb-free Component Marking
- The Pb-free “Z” designator character will be marked on the package body per the specified mark format.
Outer Packaging / Shipping Carton Marking
- All containers, invoices, and labels will be marked with the Pb-free part number with the “Z” designator character.
- Pb-free alloy category per JEDEC standard JESD97 has been added to Cirrus Logic standard labels. Pb-free product labels will be populated with the appropriate value (e1 – e7) per this specification. Non Pb-free product labels will display “N/A” in this field.
- Example: Pb-free category label examples (PDF, 84 KB)
- A separate RoHS compliance label will be displayed on the inner shipping carton, moisture barrier bag and reel for all RoHS compliant products.
- Example: RoHS compliance label examples (PDF, 68 KB)
Pb-free / RoHS Compliant Product Availability
- Most package outlines have been qualified in a Pb-free bill of materials which fully meets the requirements of the RoHS Directive.
- Availability of specific products in a RoHS compliant bill of materials is subject to support by the Sales and Marketing groups. Please contact your local Cirrus Logic representative for specific product details.
Pb-free Product Alloy Selection
- Cirrus Logic has standardized on 100% matte tin plating as the alloy of choice for leadframe based surface mount products.
- Array (BGA) style packages utilize Sn / 4.0% Ag / 0.5% Cu solder spheres
Backward Compatibility with Eutectic Sn/Pb Soldering Processes
- Matte tin plated, leadframe based products are backward compatible with existing Sn/Pb soldering processes.
- Array (BGA) packaging utilizing Sn/Ag/Cu solder spheres require higher soldering temperatures to ensure complete collapse and reflow of the solder spheres. They should not be considered backward compatible, and should only be used in conjunction with Pb-free soldering profiles.
Pb-Free Product Qualification
- Qualification method
- Moisture Sensitivity / Solder Reflow conditions for all new qualifications are being evaluated per IPC/JEDEC specification J-STD-020-C.
- JEDEC Qualification Procedure (PDF, 106 KB)
- Some qualifications have been previously completed using J-STD-020-B. These products are in the process of re-qualification to J-STD-020-C.
- Reliability testing is conducted per Cirrus Logic / industry standard procedures (JEDEC, Mil-STD, etc).
- Package qualification tests typically include:
- Pre-conditioning with 3X reflow passes
- Temperature cycling
- Temperature / humidity bias
- Autoclave
- High Temperature Storage Life
- Solderability
